3D hybrid modeling of substrate coupling noise in lightly doped mixed-signal ICs

Abstract

Because of the widely used of mixed-signal SoC, substrate coupling noise has become an important problem. A reasonable substrate model is necessary for estimating the impact of substrate noise. Compared with previous work, the proposed 3D hybrid model includes 3D RC substrate network for the aggressor and victim and macro model for the noise coupling path. Developed model of commonly used for isolating noise such as guard ring is also proposed. The efficiency of different regions of guard ring and single and double guard ring are compared and analyzed to draw a general conclusion.