L. Marechal, B. Gerfault, G. L. Rhun, M. Dinari, T. Huet, E. Richard, V. Serru, M. Camiade, C. Chang, L. Brunel, G. Mouchon
{"title":"10W K band GaN MMIC amplifier embedded in Waveguide-based Metal Ceramic Package","authors":"L. Marechal, B. Gerfault, G. L. Rhun, M. Dinari, T. Huet, E. Richard, V. Serru, M. Camiade, C. Chang, L. Brunel, G. Mouchon","doi":"10.23919/EuMIC.2019.8909524","DOIUrl":null,"url":null,"abstract":"This paper describes the design methodology and characterization of a 10W K Band packaged amplifier for space applications. The MMIC was developed on the new UMS $0.15 \\mu\\mathrm{m}$ gate length GaN technology on SiC substrate as the final stage of a downlink satellite transmitter in the 17.3-20.2 GHz frequency band. A dedicated hermetic package has been developed around the MMIC with an output waveguide transition (compatible of WR51) for low loss integration in a Solid State Power Amplifier (SSPA) output combiner. This packaged High Power Amplifier (HPA) measured in CW mode, reaches 10W output power in saturation, with an associated 35% of Power Added Efficiency (PAE) and 10° AM-PM variation. These data are provided for a package backside temperature of $90^{\\circ}\\mathrm{C}$.","PeriodicalId":228725,"journal":{"name":"2019 14th European Microwave Integrated Circuits Conference (EuMIC)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2019-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"12","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2019 14th European Microwave Integrated Circuits Conference (EuMIC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.23919/EuMIC.2019.8909524","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 12
Abstract
This paper describes the design methodology and characterization of a 10W K Band packaged amplifier for space applications. The MMIC was developed on the new UMS $0.15 \mu\mathrm{m}$ gate length GaN technology on SiC substrate as the final stage of a downlink satellite transmitter in the 17.3-20.2 GHz frequency band. A dedicated hermetic package has been developed around the MMIC with an output waveguide transition (compatible of WR51) for low loss integration in a Solid State Power Amplifier (SSPA) output combiner. This packaged High Power Amplifier (HPA) measured in CW mode, reaches 10W output power in saturation, with an associated 35% of Power Added Efficiency (PAE) and 10° AM-PM variation. These data are provided for a package backside temperature of $90^{\circ}\mathrm{C}$.