30 watt surface-mount power amplifiers for PCS and UMTS applications

E. Crescenzi, B. Griswold, A. Mohammed, R. Buss, R. Pengelly
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引用次数: 1

Abstract

Small surface-mount power amplifiers have been developed that produce 30 watts of peak power in the PCS and UMTS frequency bands. These two-stage amplifiers exhibit typical gain of 28 dB with good linearity and efficiency under CDMA signal protocols. The designs involve a combination of chip-and-wire plus SMT lumped and distributed matching elements on a thick-film substrate. The thermal design includes two levels of heat spreading through metal base elements before the PCB attachment interface. FET maximum channel temperatures for PCB mounted devices are typically 121 /spl deg/C for 5 W average CDMA output with a +85 /spl deg/C base temperature. The 30 W peak power is believed to be the highest reported for a commercial surface-mount amplifier operating in a microwave band.
用于pc和UMTS应用的30瓦表面贴装功率放大器
小型表面贴装功率放大器已经开发出来,在PCS和UMTS频段产生30瓦的峰值功率。这些两级放大器具有28db的典型增益,在CDMA信号协议下具有良好的线性度和效率。该设计包括在厚膜衬底上结合芯片和线以及SMT集总和分布匹配元件。热设计包括在PCB连接接口之前通过金属基元件的两级热传播。PCB安装器件的FET最高通道温度通常为121 /spl度/C, 5 W平均CDMA输出+85 /spl度/C基温。30w的峰值功率被认为是在微波波段工作的商用表面贴装放大器的最高功率。
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