Performance evaluation of RF MEMS packages

Abstract

An RF switch made using MEMS (Micro Electro-Mechanical System) technology shows attractive electrical characteristics that are critically needed in the next generation low power consumption, high data rate RF wireless systems. In order to provide environmental protection and at the same time preserve electrical performance of the MEMS switch, an RF package must be carefully designed. For example, it is important for the RF package to maintain low insertion loss, low return loss, and high isolation between ports of the MEMS switches. In this paper, a methodology used to analyze: the electrical performance of packaged switches is described. Simulation results of two Kyocera ceramic packages are shown. Ansoft HFSS fullwave simulator was used to obtain the package and wire bond interconnect characteristics, and combined with either measured or simulated device characteristics. The results were compared with general system specifications. Wire bond profiles, which resemble those actually were used in the packages, were created in the simulation. The three-dimensional grounding system of the packages was also implemented in the simulation. Experimental validation using TRL on-board calibration and direct SOLT package probing were also completed.