Simulation Analysis of The Optimal Process Parameters of Surface Mount Capacitor

2022 Global Reliability and Prognostics and Health Management (PHM-Yantai) Pub Date : 2022-10-13 DOI:10.1109/PHM-Yantai55411.2022.9941836

Y. Jia, J. Yuan, Xiao Dong Wang

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Abstract

As an energy storage component, capacitor is widely used in the field of aerospace. Surface mounted capacitor has the characteristics of small volume and easy to automatic assembly. But it is extremely sensitive to mechanical stress and thermal stress, failing frequently in the harsh environment of aerospace. In this paper, we used the steady-state thermal module and static structure module of ANSYS to carry out the thermal simulation and vibration simulation analysis of tantalum capacitor, and the maximum and minimum stress under different solder joint process parameters were obtained. Based on the simulation results, the thermal fatigue life of solder joint was calculated by Darveaux fatigue model, and the vibration fatigue life of the solder joint was evaluated by S-N double logarithm vibration fatigue curve. The highest life of solder joint was selected as the optimal combination of solder joint process parameters. In this paper, the optimal solder joint process parameters of tantalum capacitors were analyzed, which can guide the improvement of capacitor assembly process.

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表面贴装电容器最优工艺参数的仿真分析

电容器作为一种储能元件，在航空航天领域有着广泛的应用。表面贴装电容器具有体积小、易于自动组装的特点。但它对机械应力和热应力极为敏感，在恶劣的航天环境中经常失效。本文利用ANSYS的稳态热模块和静态结构模块对钽电容进行了热仿真和振动仿真分析，得到了不同焊点工艺参数下钽电容的最大和最小应力。基于仿真结果，采用Darveaux疲劳模型计算了焊点的热疲劳寿命，采用S-N双对数振动疲劳曲线评价了焊点的振动疲劳寿命。选择焊点的最高寿命作为焊点工艺参数的最优组合。本文分析了钽电容器的最佳焊点工艺参数，可以指导电容器组装工艺的改进。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

2022 Global Reliability and Prognostics and Health Management (PHM-Yantai)

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