Progress on model building and statistical analysis methodology of IC characteristics with process

H. Yie, Yao Jiannan
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Abstract

Combined with a microelectronic test structure, an experimental design model building methodology is developed, where a self-consistent subdomain decomposition method is used to assure high accuracy and reasonable computation costs simultaneously. With some examples, the application of the derived regression model in IC performance prediction and optimum process design is discussed. A real-time statistical process analysis methodology that is incorporated with the experimental design method is presented. The applicability of the real-time statistical analysis methodology is demonstrated.<>
集成电路过程特性模型建立与统计分析方法研究进展
结合微电子测试结构,提出了一种实验设计模型建立方法,该方法采用自洽子域分解方法,在保证高精度的同时保证合理的计算成本。结合实例,讨论了所建立的回归模型在集成电路性能预测和工艺优化设计中的应用。提出了一种结合实验设计方法的实时统计过程分析方法。验证了实时统计分析方法的适用性
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