Transient analysis of microstrip - like interconnects with ground plane aperture

Abstract

A microstrip - like interconnection with an aperture in the ground plane below the line is investigated. The resultant geometry leads to a sharp variation in the 50% delay time, 90% rise time and ± 5% settling time. Using second - order approximation, the transient analysis of such an interconnection is presented in this paper. The interconnect parameters are extracted using variational technique and are validated by FDTD and SPICE simulations. The results presented in this work can be practically used for time - domain analysis of microstrip lines also. The results can be useful in design of high - speed interconnections for MCM, RF and PCB related applications.