Millimeter-wave silicon transistor and benchmark circuit scaling through the 2030 ITRS horizon

S. Voinigescu, S. Shopov, P. Chevalier
{"title":"Millimeter-wave silicon transistor and benchmark circuit scaling through the 2030 ITRS horizon","authors":"S. Voinigescu, S. Shopov, P. Chevalier","doi":"10.1109/GSMM.2015.7175460","DOIUrl":null,"url":null,"abstract":"This paper reviews the technology requirements of future mm-wave systems-on-chip and the challenges facing mm-wave MOSFET and SiGe HBT device and benchmark circuit scaling towards 3nm gate length and beyond 1.5THz fMAX. Measurements of state-of-the-art MOSFETs, HBTs and cascodes are presented from DC to 325 GHz. Finally, simulations of the scaling of the SiGe HBT mm-wave benchmark circuit performance across future technology nodes predict that PAs with 45% PAE at 220 GHz, and transimpedance amplifiers with over 175GHz bandwidth and less than 3dB noise figure will become feasible by the year 2030.","PeriodicalId":405509,"journal":{"name":"Global Symposium on Millimeter-Waves (GSMM)","volume":"4 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2015-05-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"6","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Global Symposium on Millimeter-Waves (GSMM)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/GSMM.2015.7175460","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 6

Abstract

This paper reviews the technology requirements of future mm-wave systems-on-chip and the challenges facing mm-wave MOSFET and SiGe HBT device and benchmark circuit scaling towards 3nm gate length and beyond 1.5THz fMAX. Measurements of state-of-the-art MOSFETs, HBTs and cascodes are presented from DC to 325 GHz. Finally, simulations of the scaling of the SiGe HBT mm-wave benchmark circuit performance across future technology nodes predict that PAs with 45% PAE at 220 GHz, and transimpedance amplifiers with over 175GHz bandwidth and less than 3dB noise figure will become feasible by the year 2030.
毫米波硅晶体管和基准电路缩放到2030年ITRS地平线
本文综述了未来毫米波片上系统的技术要求,以及毫米波MOSFET和SiGe HBT器件以及基准电路向3nm栅极长度和1.5THz fMAX扩展所面临的挑战。最先进的mosfet, hbt和级联码的测量从直流到325 GHz。最后,对未来技术节点上SiGe HBT毫米波基准电路性能的缩放模拟预测,到2030年,220 GHz时PAE为45%的PAs和带宽超过175GHz、噪声系数小于3dB的跨阻放大器将成为可能。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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