Comparison of two high-end infrared thermography systems with different spectral sensitivity for thermal investigations of sensor heater elements

2012 35th International Spring Seminar on Electronics Technology Pub Date : 2012-05-09 DOI:10.1109/ISSE.2012.6273118

R. Glatz, P. Fulmek, J. Nicolics, S. Skerlan, M. Siegele, G. Radosavljevic

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引用次数: 1

Abstract

We discuss the measurement of temperature distributions using thermography, and its limitations due to wavelength and temperature dependent infrared-optical properties of the sample. A typical oxygen sensor has been realized by thick film technology: a platinum heater structure with integrated temperature sensor has been printed on a zirconia substrate. The variation of the temperature of the sensor with the applied heater current has been experimentally investigated by a three-wire resistance measurement and the application of two different high-resolution thermography systems. The first method is an easy and reliable direct method to obtain an average temperature value of the heater structure, whereas thermography gives the spatial distribution of the temperature. Thermography images of the sensor as-built and coated with a high-emissivity varnish are compared. Typical pitfalls in the interpretation of the thermal signature of the device under test resulting from unknown emission coefficients and semitransparency of the substrate material are discussed in detail.

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两种不同光谱灵敏度的高端红外热成像系统在传感器加热元件热探测中的比较

我们讨论了使用热成像测量温度分布，以及它的局限性，由于波长和温度依赖于样品的红外光学性质。利用厚膜技术实现了一种典型的氧传感器:在氧化锆衬底上印刷了带有集成温度传感器的铂加热器结构。通过三线电阻测量和两种不同的高分辨率热成像系统的应用，实验研究了传感器温度随外加加热器电流的变化。第一种方法是一种简单可靠的直接获得加热器结构平均温度值的方法，而热成像法给出了温度的空间分布。热成像图像的传感器建成和涂层高发射率清漆进行了比较。详细讨论了由于未知的发射系数和衬底材料的半透明性而导致的被测器件热特征解释中的典型缺陷。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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2012 35th International Spring Seminar on Electronics Technology

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