Integration of Thermopile on a Mid IR Waveguide

Abstract

We report integration of infrared (IR) thermopile sensor with Mid-IR waveguides via flip-chip bonding technology. A photonic device with input and output grating couplers designed at 3.72um are fabricated on silicon-on-insulator (SOI) platform and integrated with a bare thermopile chip on its output side to realize integrated photonic platform for a myriad range of sensing applications.