{"title":"Advanced ceramic packaging for microwave and millimeter wave applications","authors":"D. Wein","doi":"10.1109/APS.1993.385182","DOIUrl":null,"url":null,"abstract":"The StratEdge process, an advanced ceramic packaging technology based on the lamination of fully fired ceramics using a set of proprietary glass compounds and compatible metallizations is described. It combines both innovative and mature processing techniques with new material sets. The process has yielded superior results with respect to electrical, structural, and hermetic performance. The technology is affordable, suitable for high volume production, and does not require customized equipment. To illustrate these considerations, two simple examples of a microwave and a millimeter wave package are presented. A basic DC-20 GHz broadband microwave package is illustrated. The goal of the package is to be electrically transparent to the die and to provide thermal dissipation while maintaining a hermetic and environmentally compatible enclosure. A package that is being developed to address millimeter-wave requirements is also presented.<<ETX>>","PeriodicalId":138141,"journal":{"name":"Proceedings of IEEE Antennas and Propagation Society International Symposium","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1993-06-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"14","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of IEEE Antennas and Propagation Society International Symposium","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/APS.1993.385182","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 14
Abstract
The StratEdge process, an advanced ceramic packaging technology based on the lamination of fully fired ceramics using a set of proprietary glass compounds and compatible metallizations is described. It combines both innovative and mature processing techniques with new material sets. The process has yielded superior results with respect to electrical, structural, and hermetic performance. The technology is affordable, suitable for high volume production, and does not require customized equipment. To illustrate these considerations, two simple examples of a microwave and a millimeter wave package are presented. A basic DC-20 GHz broadband microwave package is illustrated. The goal of the package is to be electrically transparent to the die and to provide thermal dissipation while maintaining a hermetic and environmentally compatible enclosure. A package that is being developed to address millimeter-wave requirements is also presented.<>