Advanced ceramic packaging for microwave and millimeter wave applications

D. Wein
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引用次数: 14

Abstract

The StratEdge process, an advanced ceramic packaging technology based on the lamination of fully fired ceramics using a set of proprietary glass compounds and compatible metallizations is described. It combines both innovative and mature processing techniques with new material sets. The process has yielded superior results with respect to electrical, structural, and hermetic performance. The technology is affordable, suitable for high volume production, and does not require customized equipment. To illustrate these considerations, two simple examples of a microwave and a millimeter wave package are presented. A basic DC-20 GHz broadband microwave package is illustrated. The goal of the package is to be electrically transparent to the die and to provide thermal dissipation while maintaining a hermetic and environmentally compatible enclosure. A package that is being developed to address millimeter-wave requirements is also presented.<>
用于微波和毫米波应用的先进陶瓷封装
StratEdge工艺是一种先进的陶瓷封装技术,基于使用一系列专有玻璃化合物和相容金属化的全烧陶瓷层压。它结合了创新和成熟的加工技术与新的材料集。该工艺在电气、结构和密封性能方面取得了优异的效果。该技术价格合理,适合大批量生产,并且不需要定制设备。为了说明这些考虑,给出了微波和毫米波封装的两个简单示例。介绍了一种基本的dc - 20ghz宽带微波封装。封装的目标是对芯片透明,并提供散热,同时保持密封和环境兼容的外壳。还介绍了一种正在开发的解决毫米波需求的封装。
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