{"title":"Millimeter-Wave Single-Layer Full-Band WR12 Vertical Waveguide Transition","authors":"W. Ahmad, D. Kissinger, H. Ng","doi":"10.1109/RWS45077.2020.9050127","DOIUrl":null,"url":null,"abstract":"In this paper the Nippon Pillar’s low-loss substrate material F300AS is utilized to implement a planar single-layer substrate-integrated waveguide (SIW-) based vertical waveguide transitions to cover the full WR12 band. Two designs are implemented on thin and thick substrate to seek the maximum obtainable bandwidth. The SIW-WR12 transition comprises of rectangular aperture and two via pairs to widen its bandwidth. The simulated 1-dB bandwidth spans from 60-88 GHz on the thick substrate. The transition is directly mounted on the board and it does not require additional mechanical parts for fixation. Back-to-back structures were fabricated and measured for verification.","PeriodicalId":184822,"journal":{"name":"2020 IEEE Radio and Wireless Symposium (RWS)","volume":"89 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2020-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2020 IEEE Radio and Wireless Symposium (RWS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/RWS45077.2020.9050127","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1
Abstract
In this paper the Nippon Pillar’s low-loss substrate material F300AS is utilized to implement a planar single-layer substrate-integrated waveguide (SIW-) based vertical waveguide transitions to cover the full WR12 band. Two designs are implemented on thin and thick substrate to seek the maximum obtainable bandwidth. The SIW-WR12 transition comprises of rectangular aperture and two via pairs to widen its bandwidth. The simulated 1-dB bandwidth spans from 60-88 GHz on the thick substrate. The transition is directly mounted on the board and it does not require additional mechanical parts for fixation. Back-to-back structures were fabricated and measured for verification.