The challenge of GaAs IC manufacturing in Taiwan for Asian Pacific wireless market

GaAs IC Symposium. IEEE Gallium Arsenide Integrated Circuit Symposium. 23rd Annual Technical Digest 2001 (Cat. No.01CH37191) Pub Date : 2001-10-21 DOI:10.1109/GAAS.2001.964336

L.W. Yang, P. Chao, L. Wu

引用次数: 1

Abstract

The authors consider the market perspectives of the Asia Pacific area, describe a business model based on the track records of silicon IC manufacturing, and highlight technology challenges.

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台湾GaAs集成电路制造对亚太无线市场的挑战

作者考虑了亚太地区的市场前景，描述了基于硅集成电路制造记录的商业模式，并强调了技术挑战。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

GaAs IC Symposium. IEEE Gallium Arsenide Integrated Circuit Symposium. 23rd Annual Technical Digest 2001 (Cat. No.01CH37191)

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