Comparative thermal analysis of commercial and novel hybrid thermal greases

Abstract

Consumer electronics such as portable devices (laptops, smartphones) become smaller, thinner and more powerful. In such devices a passive cooling begins to play a dominant role in heat dissipation process. In passive cooling systems thermal resistance of thermal path between semiconductor junction and radiator should be progressively reduced. It can be done by application of efficient (high thermal conductivity) thermal interface materials. The main aim of the study was to provide and to characterize developed thermal greases based on mixture of nano and micro fillers, which could compete or replace the current commercial ones.