Ultra-Low On-Resistance TG-LDMOS With Three Separated Gates and High-k Dielectric Comparable to DG-LDMOS

Abstract

In this paper, a novel ultralow specific on-resistance (Ron,sp) triple gate lateral double-diffused MOS (TG-LDMOS) and high-k (HK) gate dielectric is proposed which is simulated by TCAD tool. It is the main concern for LDMOS to optimize the trade-off relationship between the Breakdown Voltage (BV) and specific on-resistance (Ron,sp). Adding another vertical gate compared to double gate LDMOS (DG-LDMOS) will increase the route of current, thus decreasing resistance obviously. In addition, the HK gate dielectric can optimize the channel current, which also reduces resistance. It is found that the proposed device shows lower resistance of 30.2m Ω · cm2 (TG-LDMOS) and 25.4 m Ω.cm2(TG-LDMOS(k)) at the same BV=180V. The Ron,sp is 22.3% and 53.1% lower than that of DG-LDMOS, respectively. Compared with DG-LDMOS and TG-LDMOS, the TG-LDMOS(k) achieves better tradeoff between the BV and Ron,sp.