The Low-Temperature Radiation-Hardened Analog Interfaces of Sensors on the Base of BiJFET Array Chips

A. Titov, I. Pakhomov, A. I. Serebryakov
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引用次数: 1

Abstract

This article presents the design results of the precision microcircuit of the instrumentation amplifier (IA) based on the fully differential difference op-amp (FDDA) and the double-channel low pass filter (LPF). It shows that the application of such IA leads to the high parameters of the sensor interface in the stability of output offset voltage (200uV < Voo < 200uV) and common-mode rejection in the extended temperature range −197°C ÷ +27°C and on exposure to the neutron flux Fn up to 1018 n/m2 and absorbed radiation dose D up to 1 Mrad. The results of the IA simulation designed on the base of radiation-hardened BiJFet technology (OJSC “Integral”, Minsk) are given.
基于BiJFET阵列芯片的传感器低温抗辐射模拟接口
本文介绍了基于全差分运算放大器(FDDA)和双通道低通滤波器(LPF)的仪表放大器(IA)精密微电路的设计结果。结果表明,这种IA的应用使得传感器接口在输出偏压稳定性(200uV < Voo < 200uV)和共模抑制性能(- 197°C ÷ +27°C)以及中子通量Fn高达1018 n/m2和吸收辐射剂量D高达1 Mrad的扩展温度范围内具有较高的参数。给出了基于辐射硬化BiJFet技术(OJSC“Integral”,Minsk)设计的IA仿真结果。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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