Microscale and Nanoscale Thermal Characterization Techniques

J. Christofferson, K. Maize, Y. Ezzahri, J. Shabani, X. Wang, A. Shakouri Baskin
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引用次数: 150

Abstract

In this paper the authors review various microscale and nanoscale thermal characterization techniques that could be applied to active and passive devices. Solid-state micro refrigerators on a chip can provide a uniform and localized temperature profile and they are used as a test vehicle in order to compare the resolution limits of various microscale techniques. After a brief introduction to conventional micro thermocouples and thermistor sensors, various contact and contactless techniques will be reviewed. Infrared microscopy is based on thermal emission and it is a convenient technique that could be used with features tens of microns in size. Resolution limits due to low emissivity and transparency of various materials and issues related to background radiation will be discussed. Liquid crystals that change color due to phase transition have been widely used for hot spot identification in integrated circuit chips. The main problems are related to calibration and aging of the material. Micro Raman is an optical method that can be used to measure absolute temperature. Micron spatial resolution with several degrees temperature resolution has been achieved. Thermoreflectance technique is based on the change of the sample reflection coefficient as a function of temperature. This small change in 10-4-10-5 range per degree is typically detected using lock-in technique when the temperature of the device is cycled. Use of visible and near IR wavelength allows both top surface and through the substrate measurement. Both single point measurements using a scanning laser and imaging with CCD or specialized lock-in cameras have been demonstrated. For ultrafast thermal decay measurement, pump-probe technique using nanosecond or femtosecond lasers have been demonstrated. This is typically used to measure thin film thermal diffusivity and thermal interface resistance. The spatial resolution of various optical techniques can be improved with the use of tapered fibers and near field scanning microscopy. While sub diffraction limit structures have been detected, strong attenuation of the signal reduces the temperature resolution significantly. Scanning thermal microscopy which is based on nanoscale thermocouples at the tip of atomic force microscope has had success in ultra high spatial resolution thermal mapping. Issues related to thermal resistance between the tip and the sample and parasitic heat transfer paths will be discussed
微尺度和纳米尺度热表征技术
本文综述了可用于有源和无源器件的各种微尺度和纳米尺度热表征技术。芯片上的固态微型冰箱可以提供均匀和局部的温度分布,它们被用作测试工具,以比较各种微尺度技术的分辨率限制。在简要介绍了传统的微热电偶和热敏电阻传感器之后,将回顾各种接触和非接触技术。红外显微镜是一种基于热发射的技术,它是一种方便的技术,可以用于几十微米大小的特征。由于各种材料的低发射率和透明度造成的分辨率限制以及与本底辐射有关的问题将被讨论。液晶由于相变而变色,已广泛应用于集成电路芯片的热点识别。主要问题与材料的校准和老化有关。微拉曼是一种可以用来测量绝对温度的光学方法。实现了微米级空间分辨率和几度温度分辨率。热反射技术是以样品反射系数随温度的变化为基础的。当设备温度循环时,通常使用锁定技术检测到每度10-4-10-5范围内的微小变化。使用可见光和近红外波长允许顶部表面和通过基板测量。单点测量使用扫描激光和成像与CCD或专门的锁定相机已经证明。对于超快的热衰减测量,已经证明了使用纳秒或飞秒激光的泵浦探测技术。这通常用于测量薄膜的热扩散率和热界面阻力。使用锥形光纤和近场扫描显微镜可以提高各种光学技术的空间分辨率。虽然已经检测到亚衍射极限结构,但信号的强衰减显著降低了温度分辨率。基于原子力显微镜尖端纳米级热电偶的扫描热显微镜在超高空间分辨率热成像方面取得了成功。与尖端和样品之间的热阻以及寄生传热路径相关的问题将被讨论
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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