Analysis of Differential Crosstalk and Transmission for Via Arrays in Low Temperature Cofired Ceramics

Ö. Yildiz, N. Pathé, Marc Bochard, Cheng Yang, C. Schuster
{"title":"Analysis of Differential Crosstalk and Transmission for Via Arrays in Low Temperature Cofired Ceramics","authors":"Ö. Yildiz, N. Pathé, Marc Bochard, Cheng Yang, C. Schuster","doi":"10.1109/SPI52361.2021.9505214","DOIUrl":null,"url":null,"abstract":"Given the ubiquitous use of via arrays in multilayer substrates based on organic materials, this work explores ceramic-based solutions instead. Assuming typical design and technology constraints, the performance of via arrays on low temperature cofired ceramics is studied in terms of crosstalk as well as transmission. Both single-ended and differential signaling are considered, thus covering a broad range of use cases for microwave applications and high-speed digital links. By employing single vias optimized with respect to 50Ω systems as fundamental building blocks for larger via arrays, different array configurations are proposed and analyzed. The question as to what moving from organic to ceramic materials and vice versa implies in terms of electrical performance is investigated. The majority of the work is based on the computationally efficient physics-based via modeling technique due to the size and complexity of the via array models, but comparisons to conventional full-wave solvers show strong agreement between the two methods up to 50GHz.","PeriodicalId":440368,"journal":{"name":"2021 IEEE 25th Workshop on Signal and Power Integrity (SPI)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2021-05-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2021 IEEE 25th Workshop on Signal and Power Integrity (SPI)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/SPI52361.2021.9505214","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1

Abstract

Given the ubiquitous use of via arrays in multilayer substrates based on organic materials, this work explores ceramic-based solutions instead. Assuming typical design and technology constraints, the performance of via arrays on low temperature cofired ceramics is studied in terms of crosstalk as well as transmission. Both single-ended and differential signaling are considered, thus covering a broad range of use cases for microwave applications and high-speed digital links. By employing single vias optimized with respect to 50Ω systems as fundamental building blocks for larger via arrays, different array configurations are proposed and analyzed. The question as to what moving from organic to ceramic materials and vice versa implies in terms of electrical performance is investigated. The majority of the work is based on the computationally efficient physics-based via modeling technique due to the size and complexity of the via array models, but comparisons to conventional full-wave solvers show strong agreement between the two methods up to 50GHz.
低温共烧陶瓷中通孔阵列的差分串扰及传输分析
鉴于通孔阵列在基于有机材料的多层衬底中的普遍使用,本研究探索了基于陶瓷的解决方案。在典型的设计和技术约束下,从串扰和传输两方面研究了低温共烧陶瓷上的过孔阵列的性能。考虑了单端和差分信号,从而涵盖了微波应用和高速数字链路的广泛用例。通过采用相对于50Ω系统优化的单通孔作为大型通孔阵列的基本构建块,提出并分析了不同的阵列配置。问题是什么移动从有机陶瓷材料,反之亦然意味着电性能方面进行了调查。由于通孔阵列模型的大小和复杂性,大部分工作都是基于计算效率高的物理通孔建模技术,但与传统的全波求解器相比,两种方法在50GHz范围内具有很强的一致性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 求助全文
来源期刊
自引率
0.00%
发文量
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术官方微信