Design and simulation of fully-symmetrical resonant pressure sensor

Yiwen Jiang, X. Du, Zhan Zhan, Bulei Xu, Wenlong Lv, Lingyun Wang, Daoheng Sun
{"title":"Design and simulation of fully-symmetrical resonant pressure sensor","authors":"Yiwen Jiang, X. Du, Zhan Zhan, Bulei Xu, Wenlong Lv, Lingyun Wang, Daoheng Sun","doi":"10.1109/NEMS.2012.6196872","DOIUrl":null,"url":null,"abstract":"A fully-symmetrical resonant pressure sensor based upon lateral drive is presented, which can avoid stress concentration that arises from temperature or vacuum packaging. Unlike conventional driving method, resonant structure with laterally driven comb capacitance allows the linear characteristic of driving force and also obtains high quality factor for its slide-film air damping. Furthermore, the detection sensitivity of the device can be improved by using differential capacitance, which will reduce shared-frequency interference phenomenon at the same time. According to the FEM analysis, the structural parameters of resonant pressure sensor are optimized. Meanwhile, the pressure sensitivity of the sensor has designed to be 22.602 Hz/kPa for a 18 μm thick diaphragm over a pressure range of 550 kPa. From temperature simulation, the temperature coefficient of sensor is -1.8233 Hz/°C in the range of -20°C~60°C without any temperature compensation. Finally, the frequency domain characteristics have been confirmed and the quality factors of sensor under different damping ratios are identified, it offers reliable reference for the choice of vacuum in resonant pressure sensor packaging.","PeriodicalId":156839,"journal":{"name":"2012 7th IEEE International Conference on Nano/Micro Engineered and Molecular Systems (NEMS)","volume":"27 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2012-03-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"4","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2012 7th IEEE International Conference on Nano/Micro Engineered and Molecular Systems (NEMS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/NEMS.2012.6196872","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 4

Abstract

A fully-symmetrical resonant pressure sensor based upon lateral drive is presented, which can avoid stress concentration that arises from temperature or vacuum packaging. Unlike conventional driving method, resonant structure with laterally driven comb capacitance allows the linear characteristic of driving force and also obtains high quality factor for its slide-film air damping. Furthermore, the detection sensitivity of the device can be improved by using differential capacitance, which will reduce shared-frequency interference phenomenon at the same time. According to the FEM analysis, the structural parameters of resonant pressure sensor are optimized. Meanwhile, the pressure sensitivity of the sensor has designed to be 22.602 Hz/kPa for a 18 μm thick diaphragm over a pressure range of 550 kPa. From temperature simulation, the temperature coefficient of sensor is -1.8233 Hz/°C in the range of -20°C~60°C without any temperature compensation. Finally, the frequency domain characteristics have been confirmed and the quality factors of sensor under different damping ratios are identified, it offers reliable reference for the choice of vacuum in resonant pressure sensor packaging.
全对称谐振压力传感器的设计与仿真
提出了一种基于横向驱动的全对称谐振压力传感器,可以避免温度或真空封装引起的应力集中。与传统的驱动方式不同,具有横向驱动梳状电容的谐振结构使驱动力具有线性特性,同时其滑膜式空气阻尼也获得了较高的质量因数。此外,利用差分电容可以提高器件的检测灵敏度,同时减少同频干扰现象。通过有限元分析,优化了谐振式压力传感器的结构参数。同时,对于18 μm厚的膜片,在550 kPa的压力范围内,该传感器的压力灵敏度设计为22.602 Hz/kPa。从温度仿真可以看出,在-20℃~60℃范围内,传感器的温度系数为-1.8233 Hz/℃,无需进行任何温度补偿。最后,确定了不同阻尼比下传感器的频域特性,确定了传感器的质量因子,为谐振压力传感器封装中真空的选择提供了可靠的参考。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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