Improved CAD formulae to calculate the input impedance of an equilateral triangular microstrip patch including radome effect

M. Biswas, A. Mandal
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引用次数: 2

Abstract

A very simple CAD formulae based on cavity model analysis is used to compute the input impedance of an Equilateral Triangular Microstrip Patch Antenna (ETMPA) for wide range of variations of superstrate parameters .The computed values are compared with theoretical and experimental values available in open literature. A simulation software (CFDTD) is also used to validate our model.
改进了包括天线罩效应在内的等边三角形微带贴片输入阻抗的CAD计算公式
利用基于腔模型分析的一个非常简单的CAD公式,计算了在大范围上层参数变化情况下的等边三角形微带贴片天线(ETMPA)的输入阻抗,并将计算值与公开文献中的理论和实验值进行了比较。利用仿真软件(CFDTD)对模型进行了验证。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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