A Terahertz Mixer Using Wide Pads and Flip Chip Schottky Diode

Abstract

In this paper, a 590-650GHz terahertz sub-harmonic mixer using wide pads was presented to reduce the mismatch caused by manual assembly of the flip chip diode. In order to improve design accuracy, the exact 3D model of the planar Schottky diode was built. And the influence of the silver glue metal layer formed in manual assembly on the performance was study. The RF/LO matching networks were designed with consideration of minimizing the influence of manual assembly. The simulation exhibits that the conversion loss of the mixer is less than 10dB range from 590GHz to 650GHz when the LO pumped power is 3dBm, and the best performance of conversion loss is 8dB at 620GHz.