Design for Displacement Strains

Charles Becht, IV
{"title":"Design for Displacement Strains","authors":"Charles Becht, IV","doi":"10.1115/1.883792_ch7","DOIUrl":null,"url":null,"abstract":"The allowable stress for thermal expansion and other deformation-induced stresses is substantially higher than for sustained loads. This is due to the difference between load-controlled conditions, such as weight and pressure, and deformation-controlled conditions, such as thermal expansion or end displacements (e.g., due to thermal expansion of attached equipment).","PeriodicalId":354785,"journal":{"name":"Process Piping: The Complete Guide to ASME B31.3, Fourth Edition","volume":"30 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2021-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Process Piping: The Complete Guide to ASME B31.3, Fourth Edition","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1115/1.883792_ch7","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0

Abstract

The allowable stress for thermal expansion and other deformation-induced stresses is substantially higher than for sustained loads. This is due to the difference between load-controlled conditions, such as weight and pressure, and deformation-controlled conditions, such as thermal expansion or end displacements (e.g., due to thermal expansion of attached equipment).
位移应变设计
热膨胀和其他变形引起的应力的许用应力大大高于持续载荷的许用应力。这是由于负载控制条件(如重量和压力)和变形控制条件(如热膨胀或末端位移(例如,由于所附设备的热膨胀)之间的差异。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 求助全文
来源期刊
自引率
0.00%
发文量
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术官方微信