Defect analysis and a new fault model for multi-port SRAMs

P. Nagaraj, Shambhu Upadhaya, K. Zarrineh, R. Adams
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引用次数: 9

Abstract

Semiconductor memory failures depend on the behavior of its components. This paper deals with testing of defects occurring in the memory cells of a multi-port memory. We also consider the resistive shorts between word/bit lines of same and different ports of the memory. The memory is modeled at the transistor level and analyzed for electrical defects by applying a set of patterns. Not only have existing models been taken into account in our simulation but also a new fault model for the multi-port memory is introduced. The boundaries of failure for the proposed defects are identified.
多端口sram缺陷分析与故障新模型
半导体存储器的故障取决于其元件的行为。本文研究了多端口存储器中存储单元缺陷的检测问题。我们还考虑了存储器的相同和不同端口的字/位线之间的电阻短路。存储器在晶体管水平上建模,并通过应用一组模式来分析电缺陷。本文的仿真不仅考虑了已有的故障模型,而且引入了一种新的多端口存储器故障模型。所提出的缺陷的失效边界被识别。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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