Ultra-High Q-factor Through Fused-silica Via (TFV) Integrated 3D Solenoid Inductor for Millimeter Wave Applications

Hae-in Kim, Renuka Bowrothu, Woosol Lee, Y. Yoon
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引用次数: 1

Abstract

In this work, a substrate integrated 3D solenoid inductor with an ultra-high quality factor (Q-factor) is demonstrated using the combination of Through Fused-silica Vias (TFVs) for low substrate loss and Copper (Cu) / Cobalt (Co) metaconductors for low conductor loss for millimeter wave (mmWave) applications. Especially, a Cu/Co metaconductor based 1 turn 3D solenoid inductor is integrated on a $300\ \mu\mathrm{m}$ thick fused-silica substrate with a small form factor of $170\ \mu\mathrm{m}\times 200\ \mu\mathrm{m}$. The Cu/Co inductor shows a peak Q-factor of 204 while a solid Cu counterpart does a Q-factor of 88.9 at 28.4 GHz, showing 130% Q-factor improvement. Modeling and optimization of the inductors has been performed using a lumped element circuit model and High Frequency Structure Simulator (HFSS) simulation. Design, fabrication, and characterization of the inductors is detailed.
用于毫米波应用的超高q因子熔融硅通孔(TFV)集成3D电磁电感器
在这项工作中,展示了一种具有超高质量因子(q因子)的基片集成3D电磁电感器,该电感器使用低基片损耗的熔融硅通孔(TFVs)和用于毫米波(mmWave)应用的低导体损耗的铜(Cu) /钴(Co)元导体的组合。特别是,基于Cu/Co元导体的1匝三维电磁电感集成在300\ \mu\ mathm {m}$厚的熔融硅衬底上,其尺寸很小,仅为170\ \mu\ mathm {m}$乘以200\ \mu\ mathm {m}$。Cu/Co电感在28.4 GHz时的峰值q因子为204,而固体Cu电感的峰值q因子为88.9,q因子提高了130%。利用集总元件电路模型和高频结构模拟器(HFSS)进行了电感器的建模和优化。详细介绍了电感器的设计、制造和特性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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