What research in software product line engineering is not solving in configuration

A. Hubaux
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引用次数: 3

Abstract

Customers no longer consider configuration special: They expect it. This expectation applies both to simple goods like t-shirts or yoghurt and to sophisticated products composed of heterogeneous hardware and software like cars or ships. The software product line community has contributed to making the software configuration of such products more robust and efficient. Yet, despite those efforts, some challenges remain open. This keynote will bring to light some of those challenges by answering the question: What is research in software product line engineering not solving in configuration? The first part of the keynote will look at one massive supplier of products engineered from heterogeneous material and digital artefacts: The semiconductor industry. In this first part, I will present some configuration challenges faced when I moved to the semiconductor industry to which my research background had no out-of-box solution. Through examples, I will highlight (1) how practical challenges can be rooted in working hypotheses, and (2) which research avenues those challenges open. The second part of the keynote takes some altitude to stare at two emergent configuration challenges. First, the once distinct line between hardware and software, developing and manufacturing, building and installing is blurring. As products embed more and more software, the need to integrate application and product lifecycle management (ALM and PLM) tools is pressing. I will illustrate how the weak integration of ALM and PLM tools can affect lead time and product quality. Secondly, the ubiquity of software in products, coupled with shrinking globalization product lifecycles, reshapes communication between parts, products, companies, and end-users. This change blurs yet another solid line: The line between product engineering and operations. Here again, I will point out why ALM, PLM, and enterprise resource planning (ERP) tool vendors struggle to keep up with the pace of the demand from companies. Those two challenges fall under the umbrella of popular themes known as cyber-physical systems, the Internet of things, or the fourth industrial revolution, a.k.a. Industry 4.0. The challenges posed by Industry 4.0 are likely to become strong drivers for software product line engineering. Indeed, smart sensors and adaptive software are the foundation stones for the new industrial revolution. Not only will those technologies be embedded in innumerable devices, but they will also have to guarantee unmatched reliability and security levels in versatile environments. The keynote will conclude with an open window on those perspectives.
软件产品线工程研究在配置中没有解决什么
客户不再认为配置是特殊的:他们期待它。这种期望既适用于t恤或酸奶等简单商品,也适用于汽车或船舶等由不同硬件和软件组成的复杂产品。软件产品线社区为使此类产品的软件配置更加健壮和高效做出了贡献。然而,尽管做出了这些努力,一些挑战仍然存在。本次主题演讲将通过回答以下问题来揭示其中的一些挑战:软件产品线工程的研究在配置中没有解决什么问题?主题演讲的第一部分将着眼于一个由异质材料和数字人工制品设计的产品的大型供应商:半导体行业。在第一部分中,我将介绍当我转移到半导体行业时所面临的一些配置挑战,因为我的研究背景没有现成的解决方案。通过例子,我将强调(1)实际挑战如何根植于工作假设,以及(2)这些挑战打开了哪些研究途径。主题演讲的第二部分着重讨论了两个紧急的配置挑战。首先,硬件和软件、开发和制造、建造和安装之间曾经泾渭分明的界限正在变得模糊。随着产品嵌入越来越多的软件,集成应用程序和产品生命周期管理(ALM和PLM)工具的需求越来越迫切。我将说明ALM和PLM工具的弱集成如何影响交货时间和产品质量。其次,产品中无处不在的软件,加上全球化产品生命周期的缩小,重塑了零件、产品、公司和最终用户之间的沟通。这种变化模糊了另一条坚实的界限:产品工程和运营之间的界限。在这里,我将再次指出为什么ALM、PLM和企业资源计划(ERP)工具供应商难以跟上公司需求的步伐。这两个挑战都属于网络物理系统、物联网或第四次工业革命(又称工业4.0)等流行主题的范畴。工业4.0带来的挑战很可能成为软件产品线工程的强大推动力。事实上,智能传感器和自适应软件是新工业革命的基石。这些技术不仅将嵌入到无数的设备中,而且还必须保证在各种环境中无与伦比的可靠性和安全性。主题演讲将以这些观点的开放窗口结束。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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