A Study On The High Temperture Platinum Etching

Abstract

1. Introductlon It is necessary to use the platinum as a bottom electrode material of the BST capacitor in highly integratad deveces, however, the Pt etching of the fine patterns is difficult due to the inherent non-reactivity of platinum. It Is revealed that the Pt etch slope of 80' was attained by OJ CI, chemistry b y elevating the substrate temperature up to 160°C. This resutlt is thought to be due to the reactlon of 0 species with TI layer and analyzed by TEM, XPS and AES.