Multilayer SIW Filter For Advanced Packaging Based On Glass Substrates

Abstract

a multilayer SIW (Substrate Integrated Waveguide) filter on glass substrates has been designed, fabricated and measured for potential utilization in advanced 3D packaging applications. Specifically, the SIW topology is chosen to use the top and bottom metal cover of the SIW cavities as the gold-to-gold bonding surfaces. The direct bonding serves as the electrical and mechanical connections at the same time. The fabricated filter operates at X band and the insertion loss is about 2.2 dB with the return loss better than 15dB. In addition, the fabrication is fully compatible with the conventional thin film fabrication process. In this article, the filter's design, fabrication process and the measurements are reported.