Enhancing the lifetime prediction methodology for photovoltaic modules based on electronic packaging experience

2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems Pub Date : 2011-04-18 DOI:10.1109/ESIME.2011.5765781

M. Guyenot, E. Peter, P. Zerrer, F. Kraemer, S. Wiese

引用次数: 7

Abstract

Photovoltaic modules as well as automotive electronics are both designed to perform more than 20 years in the field. They show many similarities, for example the material combinations (Silicon, copper, lead free interconnection), the field loads, qualification tests, etc.

查看原文本刊更多论文

基于电子封装经验的光伏组件寿命预测方法改进

光伏组件和汽车电子产品都设计为在该领域使用20年以上。它们表现出许多相似之处，例如材料组合(硅，铜，无铅互连)，现场负载，资格测试等。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

求助全文

约1分钟内获得全文求助全文

来源期刊

2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems

自引率

0.00%

发文量