A zero X-Y shrinkage low temperature cofired ceramic substrate using Ag and AgPd conductors for flip-chip bonding

Abstract

A zero X-Y shrinkage low temperature cofired ceramic (LTCC) substrate was developed, that was applied to the flip-chip bonded chip-size-packages (CSPs) and multi-chip modules (MCMs). The Ag internal conductor,the AgPd external conductor and the newly developed Ag via conductor could be used by matching the sintering shrinkage behavior with that of the zero X-Y shrinkage LTCC substrate. The flip-chip bonding using stud-bump-bonding (SBB) technique could be performed onto the external conductor of this developed substrate without Au plating and stable flip-chip bendability was obtained.