{"title":"A Ka-Band 4-Stack Power Amplifier in 130-nm SiGe BiCMOS","authors":"Hao Zhang, Kenan Xie, Keping Wang","doi":"10.1109/ucmmt49983.2020.9296123","DOIUrl":null,"url":null,"abstract":"In this paper, a single-stage SiGe BiCMOS power amplifier is demonstrated for 32-38 GHz with the stacked BJTs. To maintain a wideband bandwidth, interstage shunt inductors are used to resonate out the parasitic capacitance between the stacked BJTs. The Wilkinson power divider/combiner are also used to boost the output power. The power amplifier is designed in a 130nm SiGe BiCMOS technology. It achieves a saturated output power (PSAT) of 21 dBm and a peak PAE of 39%. The gain is larger than 17.5 dB from 32-38 GHz. The chip area is 2.09 mm2 including pads.","PeriodicalId":274385,"journal":{"name":"2020 13th UK-Europe-China Workshop on Millimetre-Waves and Terahertz Technologies (UCMMT)","volume":"167 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2020-08-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2020 13th UK-Europe-China Workshop on Millimetre-Waves and Terahertz Technologies (UCMMT)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ucmmt49983.2020.9296123","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
In this paper, a single-stage SiGe BiCMOS power amplifier is demonstrated for 32-38 GHz with the stacked BJTs. To maintain a wideband bandwidth, interstage shunt inductors are used to resonate out the parasitic capacitance between the stacked BJTs. The Wilkinson power divider/combiner are also used to boost the output power. The power amplifier is designed in a 130nm SiGe BiCMOS technology. It achieves a saturated output power (PSAT) of 21 dBm and a peak PAE of 39%. The gain is larger than 17.5 dB from 32-38 GHz. The chip area is 2.09 mm2 including pads.