Modelling High Temperature RollingTextures of FCC Metals

Abstract

A partially relaxed constraints grain deformation model is proposed to explain the influence of temperature on the rolling textures of fcc metals. The effects of the grain plastic shear in the TD/RD plane and the role of the rate sensitivity of crystallographic slip on the evolution of the texture have been investigated by numerical simulations for a random initial texture. The rate sensitivity and the TD/RD shear are assumed to increase with temperature. The progression from the Copper {112} component towards Brass {110} and S {123} type textures is predicted at higher values of the rate sensitivity and the TD/RD shear. These model predictions compare well with published hot rolling textures of aluminium alloys. The concept of grain shear partial relaxation has been validated by room and high temperature channel die tests on {110} oriented Al crystals constrained between aluminium polycrystals.