Device technology of InP/InGaAs HBTs for 40-Gb/s optical transmission application

H. Masuda, K. Ouchi, A. Terano, H. Suzuki, K. Watanabe, T. Oka, H. Matsubara, T. Tanoue
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引用次数: 17

Abstract

Several techniques that enable high-yield fabrication of high-performance high-thermal-stability InP/InGaAs heterojunction bipolar transistors (HBTs) for use in 40-Gb/s ICs were developed. The T-shaped emitter electrode structure provides a simple fabrication process. A highly-C-doped base and a new Pt/Ti/Mo/Ti/Pt/Au metal system result in a thin base and low base resistance. An InP subcollector suppresses thermal runaway at high collector current. Using these techniques, an extremely high cutoff frequency f/sub T/ of 235 GHz was achieved for an HBT, along with a static 1/2 frequency divider operating up to 44 GHz.
用于40gb /s光传输的InP/InGaAs HBTs器件技术
开发了几种用于40gb /s集成电路的高性能高热稳定性InP/InGaAs异质结双极晶体管(HBTs)的高产能制造技术。t形发射极结构提供了一种简单的制造工艺。高碳掺杂基材和新型Pt/Ti/Mo/Ti/Pt/Au金属体系使基材薄,基材电阻低。InP副集电极抑制高集电极电流时的热失控。使用这些技术,HBT实现了235 GHz的极高截止频率f/sub /,以及高达44 GHz的静态1/2分频器。
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