Conducted EMI Analysis and Modeling for the Main Circuit of a MMC Submodule

Ruodong Wang, Dong Jiang, Jianan Chen, Wei Sun
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Abstract

Electromagnetic interference (EMI) has been a nonignorable problem in modular multilevel converter(MMC) systems. Especially inside the submodules, severe EMI excited by the main circuit can be easily coupled to auxiliary circuits and affects their normal operation. In this paper, the conducted EMI of a MMC submodule is studied and modeled using time-domain simulation, based on interference source modeling and distributed parameter extraction. Then no-load test and double-pulse test are applied to verify the proposed model.
对MMC子模块的主电路进行了电磁干扰分析和建模
电磁干扰(EMI)是模块化多电平变换器(MMC)系统中不可忽视的问题。特别是在子模块内部,主电路产生的严重电磁干扰很容易耦合到辅助电路,影响辅助电路的正常工作。本文在干扰源建模和分布参数提取的基础上,对MMC子模块的传导电磁干扰进行了时域仿真研究和建模。通过空载试验和双脉冲试验对模型进行了验证。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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