A highly integrated dual-band tri-mode transceiver chipset for CDMA TIA/EIA-95 and AMPS applications

Abstract

In this paper, a two device chip-set integrating the RF transceiver front-end function for the dual-band, dual-mode CDMA/AMPS cellular telephone standard TIA/EIA-98 is described. Fabricated in a double-polysilicon, 25 GHz f/sub T/, silicon bipolar process, the transceiver achieves a total power dissipation of less than 480 mW at 3 V with 9 dBm transmitter power.