1.1 A smart design paradigm for smart chips

Cliff Hou
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引用次数: 26

Abstract

Industry application trends are driving more 3D circuitry both at the chip and system level. These technology trends are inducing new design challenges that require the semiconductor design community to go beyond existing approaches and to come up with new methods to address the challenges of smarter chips. A new design paradigm is becoming imperative to handle end-market demand for more product functionality and the corresponding increase in the complexity of the design task. To address products' distinct technological and design requirements while keeping design cycles within appropriate time-to-market windows, chip designers must leverage solutions that can be supplied by the expertise and assets of semiconductor ecosystems. At the same time, these ecosystems must evolve beyond technology-centric solutions to provide application-specific platform solutions required to meet unique product needs. This paper provides initial direction for the innovation required to realize a smart-chip design paradigm that encompasses design solutions at the chip and system level.
1.1智能芯片的智能设计范式
行业应用趋势正在推动更多的3D电路在芯片和系统层面。这些技术趋势正在引发新的设计挑战,要求半导体设计界超越现有的方法,并提出新的方法来应对智能芯片的挑战。为了应对终端市场对更多产品功能的需求以及相应的设计任务复杂性的增加,一种新的设计范式正变得势在必行。为了满足产品独特的技术和设计要求,同时将设计周期保持在适当的上市时间窗口内,芯片设计师必须利用半导体生态系统的专业知识和资产提供的解决方案。与此同时,这些生态系统必须超越以技术为中心的解决方案,提供特定于应用的平台解决方案,以满足独特的产品需求。本文为实现包含芯片和系统级设计解决方案的智能芯片设计范式所需的创新提供了初步方向。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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