M. Koetse, P. Rensing, G. V. van Heck, N. Meulendijks, P. Kruijt, E. Enting, F. Wieringa, H. Schoo
{"title":"Optical sensor platforms by modular assembly of organic electronic devices","authors":"M. Koetse, P. Rensing, G. V. van Heck, N. Meulendijks, P. Kruijt, E. Enting, F. Wieringa, H. Schoo","doi":"10.1109/SAS13374.2008.4472931","DOIUrl":null,"url":null,"abstract":"Organic electronic devices are ideal for incorporation in sensor devices due to their reduced thickness, weight, and flexibility. Here, we show that organic light emitting diodes (OLED) and organic photodiodes (OPD) can be used in a wide range of optical sensors. Printing technologies allow for cheap production of devices. Using a modular build up of these and additional components such as organic circuitry and/or embedded thinned silicon dies will allow for an almost 2 dimensional design with a variety of resulting products. The emphasis will be given on the design and the fabrication of modules for a pulse-oximeter device and integration into a wireless smart bandage. Results will be shown of a proof of concept device.","PeriodicalId":225041,"journal":{"name":"2008 IEEE Sensors Applications Symposium","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2008-03-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"4","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2008 IEEE Sensors Applications Symposium","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/SAS13374.2008.4472931","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 4
Abstract
Organic electronic devices are ideal for incorporation in sensor devices due to their reduced thickness, weight, and flexibility. Here, we show that organic light emitting diodes (OLED) and organic photodiodes (OPD) can be used in a wide range of optical sensors. Printing technologies allow for cheap production of devices. Using a modular build up of these and additional components such as organic circuitry and/or embedded thinned silicon dies will allow for an almost 2 dimensional design with a variety of resulting products. The emphasis will be given on the design and the fabrication of modules for a pulse-oximeter device and integration into a wireless smart bandage. Results will be shown of a proof of concept device.