A Wideband Dual-Polarized Antenna Designed for Antenna-in-Package (AiP)

Wei-Lun Hsu, Yuan-Chun Lin, Kuo-Hung Cheng, Shih-Cheng Lin, Chia-Chan Chang, Sheng-Fuh Chang
{"title":"A Wideband Dual-Polarized Antenna Designed for Antenna-in-Package (AiP)","authors":"Wei-Lun Hsu, Yuan-Chun Lin, Kuo-Hung Cheng, Shih-Cheng Lin, Chia-Chan Chang, Sheng-Fuh Chang","doi":"10.1109/RWS55624.2023.10046344","DOIUrl":null,"url":null,"abstract":"The paper presents a low-profile wideband dual-polarized for Antenna-in-Package (AiP) system. The antenna consists of a middle patch surrounded by artificial magnetic conductor (AMC) structure. Compared to the conventional patch antenna, the operating frequency bandwidth is increased from 6% to 20.7%. The antenna has a maximum gain of 7.8 dBi with excellent gain flatness over the operating frequency range. The overall size is about $0.56 \\lambda_{0} \\times 0.56\\lambda_{0}\\times 0.077\\lambda_{0}$. Meanwhile, the $2\\times 2$ antenna array has also been discussed.","PeriodicalId":110742,"journal":{"name":"2023 IEEE Radio and Wireless Symposium (RWS)","volume":"76 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2023-01-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2023 IEEE Radio and Wireless Symposium (RWS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/RWS55624.2023.10046344","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0

Abstract

The paper presents a low-profile wideband dual-polarized for Antenna-in-Package (AiP) system. The antenna consists of a middle patch surrounded by artificial magnetic conductor (AMC) structure. Compared to the conventional patch antenna, the operating frequency bandwidth is increased from 6% to 20.7%. The antenna has a maximum gain of 7.8 dBi with excellent gain flatness over the operating frequency range. The overall size is about $0.56 \lambda_{0} \times 0.56\lambda_{0}\times 0.077\lambda_{0}$. Meanwhile, the $2\times 2$ antenna array has also been discussed.
面向封装天线(AiP)的宽带双极化天线设计
提出了一种用于封装天线(Antenna-in-Package, AiP)系统的低速宽带双极化电路。天线由一个中间贴片组成,中间贴片被人工磁导体(AMC)结构包围。与传统贴片天线相比,工作频率带宽从6%提高到20.7%。该天线的最大增益为7.8 dBi,在工作频率范围内具有出色的增益平坦性。总体大小约为$0.56 \lambda_{0}\乘以0.56\lambda_{0}\乘以0.077\lambda_{0}$。同时,对$2\ × 2$天线阵列也进行了讨论。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 求助全文
来源期刊
自引率
0.00%
发文量
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术官方微信