Thermal simulation of bionic transpiration heat pipe system for high-power LED

Abstract

Light-emitting diodes (LED) has been developing rapidly during recent years due to the advancement of technology driven by the global demand of reducing carbon dioxide emission to the atmosphere. Meanwhile, various kinds of corresponding LED products has been generated and widely used in many fields, e.g.. However, how to improve the luminous efficiency is the challenge in LED industry. And the problem is closely related to PN junction cooling, which becomes more prominent. To solve this problem, a new type of heat dissipation structure is proposed in this paper, which uses a new kind of heat pipe - bionic transpiration heat pipe with high thermal efficiency. In addition, the simulation used ANSYS Icepak on basis of this model will show the advantages of the system we design in details. Furthermore, the application of the present design can further broaden the application fields of LED in IT, military, machinery,aviation and so forth.