Fabricaton of Microspring Probes Using Conductive Paste Dispensing

Abstract

We have developed a new fabrication technique that realizes 3-dimensional microspring probes made of conductive pastes. In the technique, ultra precise dispensing of low-temperature silver pastes on a heated substrate is continuously repeated. 50-µ m-diameter microcantilevers with an approximately 200-µ m-high post have been successfully structured on a 353 K heated substrate and their mechanical and electrical properties have been investigated. The probing resistance of as-structured cantilevers with a low contact force of 1 mN could be effectively lowered to less than 1 Ω by heat cure process with the temperature of 523 K and by fritting process with the application of 5 V -150 mA.