Miniaturized 3-dB Micromachined Broadband Lange Coupler On Alumina Substrate

P. K. Shrivastava, S. Koul, M. Abegaonkar
{"title":"Miniaturized 3-dB Micromachined Broadband Lange Coupler On Alumina Substrate","authors":"P. K. Shrivastava, S. Koul, M. Abegaonkar","doi":"10.1109/IMaRC.2018.8877204","DOIUrl":null,"url":null,"abstract":"This work presented the fabrication and measurement of 3-dB broadband miniaturized Lange coupler on Alumina substrate. The measured results are in good agreement with the simulated ones. The fabrication steps are simple. Gold bond wires of 50 micron diameter used to connect the strips and the use of bond wires same time eliminating the need of making air-bridges that are generally used to suppress higher order modes in coplanar waveguide (CPW) and a business of some money addition to the fabrication cost thus making fabrication cheaper. Alumina (εr=9.8) substrate of 5 mil thickness used as it shows low surface loss and to achieve higher frequency it is mandatory to choose a thinner substrate (<15 mil) also to achieve realizable strip width. The fabricated coupler having area of 2mm×1.28mm.","PeriodicalId":201571,"journal":{"name":"2018 IEEE MTT-S International Microwave and RF Conference (IMaRC)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2018-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2018 IEEE MTT-S International Microwave and RF Conference (IMaRC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IMaRC.2018.8877204","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 2

Abstract

This work presented the fabrication and measurement of 3-dB broadband miniaturized Lange coupler on Alumina substrate. The measured results are in good agreement with the simulated ones. The fabrication steps are simple. Gold bond wires of 50 micron diameter used to connect the strips and the use of bond wires same time eliminating the need of making air-bridges that are generally used to suppress higher order modes in coplanar waveguide (CPW) and a business of some money addition to the fabrication cost thus making fabrication cheaper. Alumina (εr=9.8) substrate of 5 mil thickness used as it shows low surface loss and to achieve higher frequency it is mandatory to choose a thinner substrate (<15 mil) also to achieve realizable strip width. The fabricated coupler having area of 2mm×1.28mm.
氧化铝基板上的小型化3db微机械宽带耦合器
本文介绍了氧化铝基板上3db宽带小型化朗格耦合器的制作和测量。实测结果与模拟结果吻合较好。制作步骤很简单。50微米直径的金键合线用于连接带和使用键合线,同时消除了通常用于抑制共面波导(CPW)中高阶模式的空气桥的需要,并且在制造成本之外增加了一些资金,从而使制造成本更低。使用5 mil厚度的氧化铝(εr=9.8)衬底,因为它显示出低表面损耗,并且为了实现更高的频率,必须选择更薄的衬底(<15 mil),以实现可实现的带状宽度。制造的耦合器的面积为2mm×1.28mm。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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