Thermal performance limits of the QFP family

Abstract

The thermal performance limits of the quad flat package (QFP) family are projected. The metrics chosen are the maximum power dissipated for constraints of junction temperature (<105 degrees C) and board temperatures (<90 degrees C), under natural and forced air convection ( approximately 1.0 m/s) equipment operating conditions. Simulation studies using a finite-difference-based thermal software for IC packages investigated the relative roles of package and equipment parameters towards the thermal performance. Experimental data from the 132 PQFP were used to validate the methodology. The limits are presented from the chip designer's as well as the package/equipment engineer's perspective. The studies allow for the prediction of thermal performance of PQFPs that incorporate enhancements. The study covers plastic as well as ceramic versions of the QFP family.<>