2.2D Die last Integrated Substrate for High Performance Applications

Abstract

In this work, a new integrated substrate structure “2.2D” is demonstrated. 2.2D substrate is a true die last solution. This solution used thin film RDL directly bonded to the substrate. This simplifies the 2.5D structure and further reduces the cost and improves the product cycle time. In this work, the 2.2D test vehicle is demonstrated with two metal layers of thin film that is bonded to a ceramic substrate. Serpentine lines run from thin film RDL to the substrate were evaluated. The process developed in this study demonstrates good registration between thin film RDL and substrate. The 2.2D TV demonstrates good warpage behavior up to the solder reflow temperature. The 2.2D structure shows good potential to be used for high performance computing substrate.