Performance analysis of short channel GaAs MESFET fabricated by SAINT method

Md. Mahmudur Rahman, M. T. Islam
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引用次数: 0

Abstract

In nanoelectronics the speed of the device is the main concern along with their size. The device integrated in nanospace, needs to work faster. The traditional silicon field effect transistors have low sensitivity and low mobility which limit device speed compare to compound semiconductors devices. On the other hand compound metal field effect transistor (MESFET) shows very high cutoff frequency, around 15GHz, for 1 μm channel whereas NMOS shows only 2GHz. The high mobility of GaAs plays the pivotal roles for this enhanced speed of MESFET. Speed of the device also increases for shorter channel length. However fabrication of short channel MESFET needs very complicated lithography process. Self aligned implantation for N+ layer technology (SAINT) is a promising method for fabricating short channel MESFET. To achieve short channel MESFET SAINT method has been opted in this work. In this paper we simulated SAINT short channel MESFET using TCAD tool then evaluate the characteristics of voltage and current for different channel length.
SAINT法制备短沟道GaAs MESFET的性能分析
在纳米电子学中,器件的速度和尺寸是主要关注的问题。该设备集成在纳米空间中,需要更快地工作。与化合物半导体器件相比,传统的硅场效应晶体管具有灵敏度低、迁移率低等缺点,限制了器件速度。另一方面,化合物金属场效应晶体管(MESFET)在1 μm通道中显示出非常高的截止频率,约为15GHz,而NMOS仅为2GHz。GaAs的高迁移率对MESFET的速度提升起着关键作用。该设备的速度也增加了较短的通道长度。然而,短沟道MESFET的制作需要非常复杂的光刻工艺。N+层自对准注入技术(SAINT)是一种很有前途的短沟道MESFET制造方法。为了实现短通道MESFET,本文选择了SAINT方法。本文利用TCAD工具对SAINT短沟道MESFET进行了仿真,并对不同沟道长度下的电压和电流特性进行了评估。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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