Investigation of Transient Liquid Phase Bonding to Low Temperature Co-fired Ceramic Substrates

Abstract

In an effort to capitalize on the high temperature potential of wide band gap semiconductors, this paper implements transient liquid phase sintering bonds on gold low temperature co-fired ceramic conductors. The strength of these bonds is characterized by die shear tests at 260 degrees Celsius. Two sample groups are used to determine the benefit, if any to the inclusion of an electroplated copper layer in the process of copper, silver, tin TLPS bonding on gold LTCC ink. The shear strength and shear modulus of each are reported.