Noncontact selective laser transfer printing and assembly of micro-sized semiconductor devices

Abstract

Laser induced forward transfer (LIFT) technique is widely considered as an efficient way to transfer print and assemble micro-sized semiconductor devices between wafers at a high speed. In this paper we propose a novel noncontact selective laser transfer printing and assembly method based on thermal releasing tape and infrared lasers. Thermal analysis and simulation are conducted to illustrate the mechanism of transfer printing. The experiment results of microchip arrays printing demonstrate that the proposed method has high precision, full selectivity, and compatibility of flexible transfer printing. The proposed method shows great potential to become a very competitive method for transfer printing of micro-devices.