Metrology

B. Bunday, George Orji
{"title":"Metrology","authors":"B. Bunday, George Orji","doi":"10.1109/irds54852.2021.00019","DOIUrl":null,"url":null,"abstract":"The Metrology Chapter identifies emerging measurement challenges from devices, systems, and integration of new materials in the semiconductor industry and describes research and development pathways for meeting them. This includes, but not limited to, measurement needs for extending CMOS, accelerating beyond CMOS technologies, novel communication devices, sensors and transducers, materials characterization and structure function relationships. This also includes metrology required in research and development, and process control in manufacturing environments [1]–[4].","PeriodicalId":160542,"journal":{"name":"2021 IEEE International Roadmap for Devices and Systems Outbriefs","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2021-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2021 IEEE International Roadmap for Devices and Systems Outbriefs","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/irds54852.2021.00019","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0

Abstract

The Metrology Chapter identifies emerging measurement challenges from devices, systems, and integration of new materials in the semiconductor industry and describes research and development pathways for meeting them. This includes, but not limited to, measurement needs for extending CMOS, accelerating beyond CMOS technologies, novel communication devices, sensors and transducers, materials characterization and structure function relationships. This also includes metrology required in research and development, and process control in manufacturing environments [1]–[4].
计量
计量章节确定了半导体行业中设备,系统和新材料集成的新兴测量挑战,并描述了满足这些挑战的研究和开发途径。这包括但不限于扩展CMOS的测量需求,加速超越CMOS技术,新型通信设备,传感器和换能器,材料表征和结构功能关系。这也包括研究和开发所需的计量,以及制造环境中的过程控制[1]-[4]。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 求助全文
来源期刊
自引率
0.00%
发文量
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术官方微信