EMC performance analysis of a processor/memory system using PCB and Package-On-Package

Abstract

In this paper, the signal integrity (SI) and Electromagnetic Compatibility (EMC) performance of System-On-Chip (SoC) and stacked memory using Package-On-Package (PoP) technology is investigated. The reconfiguration of the IC-EMC software platform to PoP is described. From an existing 2D assembly using a discrete 65-nm SoC product, the benefits of PoP integration using a next-generation (NG) 28-nm product with stacked memory are analyzed, based on simulation and predictive analysis performed using IC-EMC software platform.