The features of chip resistors usage in hybrid microwave integrated circuits

Abstract

High frequency measurements from 3 to 15 GHz of chip-resistors are reported in this paper. The chip-resistors under test have been mounted in the gap of the microstrip line in two ways: with the resistive layer up («wrap around») and with the resistive layer down («flip chip»). The impedance of chip-resistors depends on its mounting method. Flip chip mounting method reduces the imaginary part of impedance: reactance value of flip chip mounting can be a few tens of percents less than the same value obtained using the wrap around mounting. Therefore, the refined model of chip-resistors has been designed. These results can be used for improving design efficiency of the microwave devices made by the hybrid technology.