A triple-stacked Class-E mm-wave SiGe HBT power amplifier

K. Datta, J. Roderick, H. Hashemi
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引用次数: 13

Abstract

A Q-band, single ended, two-stage, triple-stacked, Class-E power amplifier is designed and fabricated in a 0.13 μm SiGe HBT BiCMOS process. The Class-E amplifier comprises of three series-stacked HBTs with capacitive divider networks at the HBT bases and collectors to ensure proper large signal swing and beyond BVCEO operation at mm-wave frequencies. The measured performance of the fabricated chip show 22.2 dBm maximum output power at 20.8% peak power added efficiency, and 15.4 dB of power gain across 4 GHz centered around 40 GHz for a supply voltage of 6.5 V. The total chip area including the pads is 0.8 mm × 1.28 mm.
一种三堆叠e类毫米波SiGe HBT功率放大器
采用0.13 μm SiGe HBT BiCMOS工艺设计并制作了q波段单端两级三堆叠e类功率放大器。e类放大器由三个串联堆叠的HBT组成,在HBT基座和集电极上带有电容分压器网络,以确保适当的大信号摆幅和在毫米波频率下超过BVCEO工作。该芯片的测量性能显示,在峰值功率增加效率为20.8%时,最大输出功率为22.2 dBm,在电源电压为6.5 V时,以40 GHz为中心的4 GHz范围内的功率增益为15.4 dB。包括焊盘在内的总芯片面积为0.8 mm × 1.28 mm。
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