PECVD of GexS1−x films for nano-ionic redox conductive bridge memristive switch memory

M. R. Latif, M. Mitkova, G. Tompa, E. Coleman
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引用次数: 1

Abstract

This study is related to fabrication and characterization of redox conductive bridge memristors (RCBM). An active region in RCBM is formed by chalcogenide glass (ChG) doped with silver (Ag). We report the application of plasma enhanced chemical vapor deposition (PECVD) method for depositing ChG films which gives the advantage of flexibility in the composition and structure not easily achieved with sputtering or thermal evaporation. The growth kinetics of the deposition process, as well as the properties of the films is investigated. Optimal deposition conditions for reliable device performance are determined. The electrical characteristics of the devices fabricated at these conditions are also tested.
用于纳米离子氧化还原导电桥阻开关存储器的GexS1−x薄膜的PECVD
本研究涉及氧化还原导电桥式忆阻器(RCBM)的制备和表征。在RCBM中加入银(Ag)的硫系玻璃(ChG)形成了一个活性区。我们报道了等离子体增强化学气相沉积(PECVD)方法在ChG薄膜沉积中的应用,该方法在成分和结构上具有灵活性,这是溅射或热蒸发难以实现的。研究了沉积过程的生长动力学以及薄膜的性能。确定了可靠器件性能的最佳沉积条件。还测试了在这些条件下制造的器件的电气特性。
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